Dell PowerEdge R760 Server Overview
The Dell PowerEdge R760 is Dell’s latest two-socket, rack server that is designed to run complex workloads using highly scalable memory, I/O, and network options.
The 2U, 2 socket Dell PowerEdge R760 enables faster time to value with peak compute performance, through optimum configurations.The 2U, 2 socket Dell PowerEdge R760 enables faster time to value with peak compute performance, through optimum configurations.
System Features
● Up to 2 x 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors with up to 56 cores
● Up to 2 x 5th Gen Intel® Xeon® Scalable Processors with up to 64 cores
● Optional Direct Liquid Cooling for required CPU SKU and/or configurations
● 32 DDR5 DIMM slots
● Two redundant AC or DC power supply units
● Up to 12 x 3.5-inch SAS/SATA, or 24 x 2.5-inch, 16 x 2.5-inch, 8 x 2.5-inch, or 2 x 2.5-inch (rear), 4 x 2.5-inch (rear), 4 x EDSFF E3.S (rear) SAS, SATA, or NVMe (HDD/SSD) drives
● Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) drives
● PCI Express® (PCIe) 5.0 enabled expansion slots
● Network interface technologies to cover Network Interface Card (NIC)
Gain the performance you need with the full-featured Dell PowerEdge R760 enterprise rack server. Designed to deliver peak compute performance through optimum configurations, the PowerEdge R760 optimizes the most demanding workloads like AI and Machine Learning.
- Add up to two 5th Generation Intel® Xeon® Scalable processors with up to 64 cores for faster and more accurate processing performance
- Accelerate in-memory workloads with up to 32 DDR5 RDIMMS up to 5600 MT/sec (1DPC)
- Support for GPUs including 2 x double wide or 6 x single-wide for workloads requiring acceleration
- New Smart Flow chassis optimizes airflow to support the highest core count CPUs in an air-cooled environment within the current IT infrastructure
Key Workloads
The Dell PowerEdge R760 offers powerful performance in a purpose-built, cyber resilient, mainstream server. Ideal for:
● Mixed Workload Standardization
● Database and Analytics
● Virtual Desktop Infrastructure
● Artificial Intelligence and Machine Learning
Processor Features
The 4th Generation Intel® Xeon® Processors stack is the next generation data center processor offering with significant performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids accelerate customer usages with unique workload optimizations.
The following lists the features and functions that are in the 4th Generation Intel® Xeon® Scalable Processor offering:
● Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multisocket bandwidth
● More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
● Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC)and 4400 MT/s in two DIMM per channel (2DPC)
● New built-in accelerators for data analytics, networking, storage, crypto, and data compression
● New Xeon Max processor with integrated 64 GB High Bandwidth Memory (HBM) to increase performance in memory-bound
applications
Storage Controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.16G PERC Controller offerings are a heavy leverage of the 15G PERC family. The Value and Value Performance levels carry over to 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs performance and enhanced SSD performance.
Supported Drives
The table shown below lists the internal drives that are supported in R760.
| Form Factor | Type | Speed | Rotational Speed | Capacities |
| 2.5 inches | vSAS | 12 Gb | SSD | 1.92 TB, 3.84 TB, 960 GB, 7.62 TB |
| 2.5 inches | SAS | 24 Gb | SSD | 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB |
| 2.5 inches | SATA | 6 Gb | SSD | 1.92 TB, 480 GB, 960 GB, 3.84 TB |
| 2.5 inches | NVMe | Gen4 | SSD | 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800GB, 400 GB |
| 2.5 inches | DC NVMe | Gen4 | SSD | 3.84 TB, 960 GB |
| 2.5 inches | SAS | 12 Gb | 10 K | 600 GB, 1.2 TB, 2.4 TB |
| EDSFF E3.S | NVMe | Gen5 | SSD | 3.84 TB, 7.68 TB |
| 3.5 inches | SATA | 6Gb | 7.2 K | 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB |
| 3.5 inches | SAS | 12 Gb | 7.2 K | 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB |
Technical Specifications of Dell PowerEdge R760 Server
| Category | Options (Full Web Description - With Line Breaks) |
| 1. Components: Chassis & Base | • PowerEdge R760 Server |
| • None (Chassis Certification) | |
| • PowerEdge NEBS Tested Configuration | |
| • No Trusted Platform Module | |
| • Trusted Platform Module 2.0 V6 | |
| • No Bezel | |
| • PowerEdge 2U LCD Bezel | |
| • PowerEdge 2U Standard Bezel | |
| 1. Components: Chassis Config | • 2.5" Chassis with up to 8 NVMe Direct Drives, 2 CPU |
| • 2.5" Chassis with up to 8 NVMe HWRAID Drives, Front PERC 11, 2 CPU | |
| • 2.5" Chassis with up to 8 NVMe HWRAID Drives, Front PERC 12, 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, LP Adapter PERC 11, 1 or 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, 2x2.5" Rear SAS/SATA Drives, LP Adapter PERC 11, 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, 2x2.5" Rear SAS/SATA Drives, LP Adapter PERC 12, 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, 4x2.5" Rear SAS/SATA drives, LP Adapter PERC 11, 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, 4x2.5" Rear SAS/SATA drives, LP Adapter PERC 12, 2 CPU | |
| • 3.5" Chassis with up to 12 SAS/SATA Drives, 4x2.5" Rear NVMe Direct drives, LP Adapter PERC 11, 2 CPU | |
| • 2.5" Chassis with up to 16 SAS/SATA Drives, Smart Flow, Front PERC 11, 2 CPU | |
| • 2.5" Chassis with up to 16 SAS/SATA Drives, Smart Flow, Front PERC 12, 2 CPU | |
| • 2.5" Chassis with up to 16 NVMe Direct Drives, Smart Flow, 2 CPU | |
| • 2.5" Chassis with up to 16 NVMe HWRAID Drives, Smart Flow, Dual Controller, Front PERC 11, 2 CPU | |
| • 2.5" Chassis with up to 16 NVMe HWRAID Drives, Smart Flow, Dual Controller, Front PERC 12, 2 CPU | |
| • 2.5" Chassis up to 16 Drives (8 SAS/SATA + 8 NVMe HWRAID), Smart Flow, 2 PERC, Front PERC 11, 1 CPU | |
| • 2.5" Chassis up to 16 Drives (8 SAS/SATA + 8 NVMe HWRAID), Smart Flow, 2 PERC, Front PERC 12, 1 CPU | |
| • 2.5" Chassis with up to 24 Drives (16 SAS/SATA + 8 NVMe Direct), Front PERC 12, 2 CPU | |
| • 2.5" Chassis up to 24 SAS/SATA Drives including 8 Universal Slots (NVMe Direct), Front PERC 12, 2 CPU | |
| • 2.5" Chassis with up to 24 SAS/SATA Drives, Front PERC 11, 2 CPU | |
| • 2.5" Chassis with up to 24 SAS/SATA Drives, Front PERC 12, 2 CPU | |
| • 2.5" Chassis with up to 24 NVMe Direct Drives (Uses PCIe Paddle Boards for Front Drive Access) | |
| • 2.5" Chassis with up to 24 NVMe Switched Direct Drives | |
| • 2.5" Chassis with up to 24 NVMe HWRAID Drives, Dual Controller, Front PERC 12, 2 CPU | |
| • Chassis with up to 16 E3.S NVMe Direct Drives, 2 CPU | |
| • Chassis with up to 16 E3.S NVMe HWRAID Drives, Dual Controller, Front PERC 12, 2 CPU | |
| • No HD, No Backplane, 1 CPU | |
| 1. Components: Processor (Platinum) | • Intel® Xeon® Platinum 8452Y 2G, 36C/72T, 16GT/s, 67.5M Cache, Turbo, HT (300W) DDR5-4800 |
| • Intel® Xeon® Platinum 8558U 2G, 48C/96T, 260M Cache, Turbo, HT (300W) DDR5-4800 | |
| • Intel® Xeon® Platinum 8462Y+ 2.8G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (300W) DDR5-4800 (No longer available) | |
| • Intel® Xeon® Platinum 8468 2.1G, 48C/96T, 16GT/s, 105M Cache, Turbo, HT (350W) DDR5-4800 | |
| • Intel® Xeon® Platinum 8568Y+ 2.3G, 48C/96T, 20GT/s, 300M Cache, Turbo, HT (350W) DDR5-5600 | |
| 1. Components: Processor (Gold) | • Intel® Xeon® Gold 5512U 2.1G, 28C/56T, 52.5M Cache, Turbo, HT (185W) DDR5-4800 |
| • Intel® Xeon® Gold 5418N 1.8G, 24C/48T, 16GT/s, 45M Cache, Turbo, HT (165W) DDR5-4400 (No longer available) | |
| • Intel® Xeon® Gold 5418Y 2G, 24C/48T, 16GT/s, 45M Cache, Turbo, HT (185W) DDR5-4400 (No longer available) | |
| • Intel® Xeon® Gold 6421N 1.8G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (185W) DDR5-4800 | |
| • Intel® Xeon® Gold 6526Y 2.8G, 16C/32T, 20GT/s, 37.5M Cache, Turbo, HT (195W) DDR5-5200 | |
| • Intel® Xeon® Gold 6430 2.1G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (270W) DDR5-4400 | |
| • Intel Xeon Gold 6434 3.7G, 8C/16T, 16GT/s, 22.5M Cache, Turbo, HT (195W) DDR5-4800 | |
| • Intel® Xeon® Gold 6438N 2G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (205W) DDR5-4800 | |
| • Intel® Xeon® Gold 6442Y 2.6G, 24C/48T, 16GT/s, 60M Cache, Turbo, HT (225W) DDR5-4800 (No longer available) | |
| • Intel® Xeon® Gold 6544Y 3.6G, 16C/32T, 20GT/s, 45M Cache, Turbo, HT (270W) DDR5-5200 | |
| • Intel® Xeon® Gold 6444Y 3.6G, 16C/32T, 16GT/s, 45M Cache, Turbo, HT (270W) DDR5-4800 | |
| • Intel® Xeon® Gold 6548N 2.8G, 32C/64T, 20GT/s, 60M Cache, Turbo, HT (250W) DDR5-5200 | |
| • Intel® Xeon® Gold 6448Y 2.1G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (225W) DDR5-4800 | |
| • Intel® Xeon® Gold 6454S 2.2G, 32C/64T, 16GT/s, 60M Cache, Turbo, HT (270W) DDR5-4800 | |
| 1. Components: Processor (Other) | • Intel® Xeon® Silver 4416+ 2G, 20C/40T, 16GT/s, 37.5M Cache, Turbo, HT (165W) DDR5-4000 |
| • Intel® Xeon® Bronze 3408U 1.8G, 8C/8T, 16GT/s, 22.5M Cache, No Turbo, HT (125W) DDR5-4000 | |
| • Intel® Xeon® Max 9460 2.2G, 40C/80T, 16GT/s, 97.5M Cache, Turbo, HT (350W) DDR5-4800 | |
| • Intel® Xeon® Max 9462 2.7G, 32C/64T, 16GT/s, 75M Cache, Turbo, HT (350W) DDR5-4800 | |
| • Intel® Xeon® Max 9470 2G, 52C/104T, 16GT/s, 105M Cache, Turbo, HT (350W) DDR5-4800 | |
| • Intel® Xeon® Max 9480 1.9G, 56C/112T, 16GT/s, 112.5M Cache, Turbo, HT (350W) DDR5-4800 | |
| • No Additional Processor | |
| • No HBM (Additional Processor Features) | |
| 1. Components: Thermal & Memory | • Heatsink for 1 CPU configuration (CPU greater than 165W) |
| • Heatsink for 1 CPU with GPU configuration | |
| • Performance Optimized Memory Configuration | |
| • 4800MT/s RDIMMs | |
| • 5600MT/s RDIMMs | |
| • 6400MT/s RDIMMs | |
| • 16GB RDIMM 6400Mt/s, Single Rank | |
| • 32GB RDIMM, 6400MT/s, Dual Rank | |
| 1. Components: RAID & Storage | • C2, RAID 0 for HDDs or SSDs (Matching Type/Speed/Capacity) |
| • C3, RAID 1 for 2 HDDs or SSDs (Matching Type/Speed/Capacity) | |
| • C4, RAID 5 for 3 or more HDDs or SSDs (Matching Type/Speed/Capacity) | |
| • C7, Unconfigured RAID for HDDs or SSDs (Mixed Drive Types Allowed) | |
| • C8, RAID 1 on Front (Matching Type/Speed/Capacity) + Unconfigured RAID (Mixed Drive Types Allowed) | |
| • PERC H755 with rear load Brackets | |
| • 7.68TB SSD SAS Read Intensive up to 24Gbps 512e 2.5in Hot-Plug 1DWPD, AG Drive | |
| • 1.92TB SSD SAS, Read Intensive, up to 24Gbps 512e 2.5in Hot-Plug, AG Drive | |
| • 1.6TB SSD SAS Mixed Use up to 24Gbps 512e 2.5in Hot-Plug 3DWPD, AG Drive | |
| • 800GB SSD SAS, Mixed Use, up to 24Gbps 512e 2.5 Hot Plug, AG Drive, 3DWPD | |
| • 3.84TB SSD SATA Read Intensive 6Gbps 512e 2.5in Hot-plug AG Drive, 1 DWPD | |
| • 1.92TB SSD SATA Read Intensive 6Gbps 512e 2.5in Hot-plug AG Drive, 1 DWPD | |
| • 1.92TB SSD SATA Mixed Use 6Gbps 512e 2.5in Hot-plug AG Drive, 3 DWPD | |
| • 2.4TB 10K RPM Self-Encrypting SAS 12Gbps 512e 2.5in Hot-plug Hard Drive, FIPS-140 SED | |
| • 2.4TB Hard Drive SAS FIPS-140 10K 512e 2.5in Hot-Plug | |
| • 2.4TB Hard Drive SAS ISE 12Gbps 10K 512e 2.5in Hot-Plug | |
| • 1.2TB Hard Drive ISE SAS 12Gbps 10k 512n 2.5in Hot-Plug | |
| • 1.2TB Hard Drive SAS 12Gbps 10k 512n 2.5in Hot Plug | |
| 1. Components: Network & Expansion | • No OCP 3.0 mezzanine NIC card, Blank Filler Only |
| • Broadcom 5720 Quad Port 1GbE BASE-T Adapter, OCP NIC 3.0 | |
| • Broadcom 57414 Dual Port 10/25GbE SFP28, OCP NIC 3.0 | |
| • Broadcom 57416 Dual Port 10GbE BASE-T Adapter, OCP NIC 3.0 | |
| • Broadcom 57454 Quad Port 10GbE Base-T Adapter, OCP NIC 3.0 | |
| • Broadcom 5720 Dual Port 1GbE LOM | |
| • Broadcom 5719 Quad Port 1GbE BASE-T Adapter, PCIe Low Profile/Full Height | |
| • Broadcom 57414 Dual Port 10/25GbE SFP28 Adapter, PCIe Low Profile/Full Height, V2 | |
| • Intel Ethernet i350 Quad Port 1GbE BASE-T Adapter, PCIe Low Profile/Full Height | |
| • Intel X710-T2L Dual Port 10GbE BASE-T Adapter, PCIe Low Profile/Full Height | |
| • Intel X710-T4L Quad Port 10GbE BASE-T Adapter, PCIe Low Profile | |
| • Mellanox ConnectX-6 Single Port HDR VPI Infiniband Adapter, PCIe Low Profile | |
| • Nvidia ConnectX-6 Lx Dual Port 10/25GbE SFP28, No Crypto, PCIe Low Profile/Full Height | |
| • Nvidia ConnectX-7 Single Port NDR200 VPI/200GbE OSFP PCIe LP, No Crypto | |
| • Emulex LPe36002 Dual Port FC64 Fibre Channel HBA, PCIe Low Profile/Full Height | |
| • Emulex LPe35002 Dual Port FC32 Fibre Channel HBA, PCIe Low Profile/Full Height | |
| • Agnostic Dual Port 32GB/64GB Fibre Channel HBA, PCIe Low Profile/Full Height | |
| • QLogic 2770 Single Port 32Gb Fibre Channel HBA, PCIe Full Height | |
| • HBA355e Adapter FH & LP, DIB | |
| • PERC H965e, Adapter Low Profile, DIB | |
| • HBA465e Adapter Low Profile, DIB | |
| 1. Components: Power & Cooling | • Very High Performance Fan x6 |
| • High Performance Fan x6 | |
| • Dual, Hot-Plug, Power Supply, 700W MM HLAC (ONLY FOR 200-240Vac) Titanium, Redundant (1+1) | |
| • Dual, Hot-Plug, Fault Tolerant Redundant PSU (1+1), 700W MM HLAC (ONLY FOR 200-240Vac) Titanium | |
| • Dual, Hot-Plug, Fully Redundant Power Supply (1+1), 800W, Mixed Mode | |
| • Dual, Hot-Plug, Power Supply FTR, 1100W MM (100-240Vac) Titanium, Redundant (1+1) | |
| • Single, Hot-Plug, Power Supply, 700W MM HLAC Titanium Non Redundant (1+0) | |
| • Single, Hot-Plug, Power Supply Non Redundant (1+0), 800W, Mixed Mode | |
| • Single, Hot-Plug, Power Supply, 1100W MM Titanium, Non Redundant (1+0) | |
| • Single, Non-Redundant (1+0), Hot-Plug Power Supply, 1400W 277VAC or 260-400VDC ONLY, Titanium | |
| • Single, Non-Redundant (1+0), Hot-Plug Power Supply, 1400W MM, Titanium | |
| 1. Components: Risers & Accelerators | • Riser Config 9, 3x8 FH Slots (Gen5), 1x16 LP Slot (Gen4) |
| • Riser Config 10, Half Length, 1x8 FH Slot (Gen5), 1x16 FH Slot (Gen5), 1x16 LP Slot (Gen4) | |
| • Riser Config 10, Full Length, 1x8 FH Slot (Gen5), 1x16 LP Slot (Gen4), 1x16 FH DW GPU Capable Slot (Gen5) | |
| • GPU Ready Configuration Install Kit R760 V2 H++ | |
| • NVIDIA Ampere A2, PCIe, 60W, 16GB Passive, Single Wide, Full Height GPU, V2 | |
| • Partner DPU, NVIDIA Bluefield-2 Dual Port 25GbE SFP56 PCIe FH DPU | |
| • Intel vRAN Accelerator ACC100 Adapter, PCIe Low Profile | |
| 1. Components: Others | • BOSS-N1 controller card + with 2 M.2 480GB/960GB (RAID 1) |
| • BOSS-N1 controller card + with 1 M.2 480GB/960GB (RAID 0) | |
| • BOSS Blank | |
| • Quick Sync 2 (At-the-box mgmt) | |
| • No Quick Sync | |
| • iDRAC Force Change/Legacy/Factory Generated Password for OCP cards | |
| • iDRAC Group Manager, Disabled/Enabled | |
| 2. OS & Software | • None (Secondary OS) |
| • Red Hat Enterprise Linux | |
| • Windows Server 2025 (Standard or DataCenter) | |
| 3. Virtualization | • None |
| 4. Accessories | • NEMA 5-15P to C13 Wall Plug, 125 Volt, 15 AMP, 10 Feet (3m), Power Cord, North America |
| • IRSM 2073 to C13, 250 Volt, 10 AMP, 2.5 Meters, Argentina, Power Cord | |
| • NBR 14136 2P+T to C13, 250V, 10A, 2m, Brazil Power Cord | |
| • C13 to C14, PDU Style, 12 AMP, 6.5 Feet (2m) Power Cord, North America | |
| • C13 to C14, PDU Style, 12 AMP, 13 Feet (4m) Power Cord, North America | |
| • CEI 23-50 to C14, 220 Volt, 10 AMP, 2 Meters, Chile, Power Cord | |
| • No Power Cord | |
| • Dell EMC PowerEdge QSFP28 SR4 100GbE 85C optic | |
| • SFP28 SR Optic, 25GbE, 85C | |
| • SFP+ SR Optic, 10GbE, for all SFP+ ports except high temp validation warning cards | |
| • Dell Networking, Cable, SFP+ to SFP+, 10GbE, Copper Twinax Direct Attach Cable, 1/3 Meter | |
| 5. Shipping & Documentation | • Standard Shipping |
| • Motherboard supports ALL CPUs (required for CPUs 250W and above) | |
| • Paper and Electronic documentation included with your order | |
| 6. Others | • Power Saving Dell Active Power Controller / BIOS Setting |
| • Performance BIOS Setting | |
| • UEFI BIOS Boot Mode with GPT Partition | |
| • No Energy Star | |
| • No-OS Partition Removed | |
| • ASHRAE A3 (40C) / A4 (45C) ambient environment | |
| • No DPUs Cable Required, No DPU | |
| • No Cables Required, No GPU Blanks | |
| 7. Other Services | • Consulting: Expert guidance to help you grow, optimize and transform your IT environment. |
| • Support: From drivers and manuals to diagnostic tools and replacement parts. | |
| • Deployment: ProDeploy Enterprise Suite: Basic hardware installations through planning, configuration and complex integrations. | |
| • Education: Expansive suite of training services including instructor-led and self-paced online training. |
Return and Exchange Policy
Thank you for choosing Huatelecom! We value your trust and strive to provide high-quality products and exceptional service. Below is our comprehensive return and exchange policy to ensure your rights are protected.
1. Return Policy
-
Eligibility for Returns (Quality Issues Only):
If the product has quality defects that affect its normal usage, you are eligible to apply for a return within 7 calendar days of receiving the product. The following conditions must be met:- The product must be unused, with all original packaging, accessories, and manuals intact.
- A valid proof of purchase (order number, invoice, etc.) must be provided.
- Clear evidence of the defect, such as photos or videos, must be submitted for verification.
-
Shipping Costs for Returns:
If the return is due to quality issues, Huatelecom will cover the international shipping costs for returning the product. -
Refund Processing:
Once the returned product is received and inspected, the refund will be processed within 7 business days. The refund will be issued through the original payment method, and processing times may vary depending on your payment provider.
2. Exchange Policy
-
Eligibility for Exchanges (Quality Issues Only):
You may request an exchange if the product develops a quality issue within 15 calendar days of receipt. The conditions for eligibility are:- The product must be returned with all original packaging, accessories, and manuals.
- Proof of purchase and evidence of the defect must be provided.
-
Shipping Costs for Exchanges:
Huatelecom will bear the international shipping costs for the exchange. -
Exchange Process:
Upon receiving the defective product, we will inspect it and send a replacement product within 7 business days.
3. Warranty Service
-
Coverage During the Warranty Period:
For products within the warranty period, if quality issues arise, we will provide a replacement free of charge with your next order. No additional shipping costs will be incurred for the replacement. -
Out-of-Warranty Repairs:
For products outside the warranty period, repairs can be arranged. However, customers will need to cover theround-trip international shipping costs for sending the product to us and receiving it back after repair.
4. Damages or Loss During Shipping
-
For Customers Who Purchased Shipping Insurance:
If the product is damaged or lost during shipping, the insurance company will compensate for the loss. Customers must:- Submit a compensation claim within 15 calendar days of the order being shipped.
- Provide required documentation, such as photos of the damaged packaging, damaged product, or proof of non-delivery.
- Huatelecom will assist in the claim process to ensure timely resolution.
-
For Customers Without Shipping Insurance:
If you choose not to purchase shipping insurance, Huatelecom will not be liable for any damages or losses incurred during transit.
5. Application Process for Returns, Exchanges, or Claims
-
For further assistance, please reach out to us:
- Email: sales@huatelecom.com
- Phone: +852 44652638
- Business Hours: Monday to Friday, 9:00 AM - 6:00 PM (GMT+8)
Provide your order number, issue description, and supporting evidence (photos, videos, etc.).
-
Request Review:
Our team will review your application within 1-3 business days and notify you of the outcome. -
Return or Exchange Process:
- If approved, you will receive instructions on how to return the product or proceed with the exchange.
- For insurance claims, we will assist in coordinating with the insurance company.
-
Refund or Replacement:
Once the product is received and inspected, we will process your refund, exchange, or warranty claim promptly.
6. Important Notes
-
Timeframes:
- Returns must be initiated within 7 days of receipt.
- Exchanges must be requested within 15 days of receipt.
- Warranty replacements depend on the warranty terms for the specific product.
-
Condition of Returned Products:
Products must be returned in their original condition with all accessories and packaging intact. Damaged, altered, or incomplete items may not qualify for returns or exchanges. -
Shipping Insurance:
We highly recommend purchasing shipping insurance to protect against potential damages or losses during transit. -
Non-Eligible Returns/Exchanges:
- Products with intentional damage or misuse.
- Issues reported beyond the specified timeframes.
- Non-Huatelecom products or items purchased from unauthorized channels.
At Huatelecom, your satisfaction is our top priority. Thank you for trusting us with your business!